Job ContentAs a Process Engineer, you will be part of the Fab Engineering Team and the Technical Operations Team to support the business in delivering products to meet technical specifications and time-lines. You will work mostly in the clean room as well as the Lab areas, to optimise existing processes to support R&D and manufacturing wafers. Also, you will work closely with facility/equipment engineers as well as integration engineers and develop new processes in the thin film and dry etch process modules to meet new device requirements for future technology, and also provide support to transfer processes to large volume manufacturing.Main Responsibilities Day to day operation owner of dielectric thin film deposition and dry etching tools.Direct technicians/operators to process R&D and manufacturing wafers to meet schedules.Schedules and complete (hands on where necessary) maintenance activiies on all related toolsMaintain statistical process control (SPC) charts of dielectric thin film deposition and dry etching tools to establish a stable and robust processing platform. Monitor process output data records against specs, and make necessary process corrections and adjustments.Assist in creating building blocks for thin film deposition and dry etching processes.Interfacing to design and testing teams (spec reviews, FMEA etc)Document tool operation and process details and white standard of procedures (SOPs)Provide process instructions/training for Technician/operators and engineering colleagues.Develop new processes to meet product and technology roadmap requirements.Deploy change control processes as required.Skills/QualificationsEssential Minimum of 3 years Fab experience in either of the following; Film Deposition, Dry Etching, Wet Etching or other process development, such as (Ellipsometry).Experience with deposition, etching and other process tools, including but not limited to PECVD, RIE and ICP.Good dexterity for handling InP Wafers and samples.Knowledge and experience of SPC processes.DesirableGood knowledge of InP based materials and ICP etching.High level proficiency in SPC, 6o techniques and gauge R&R studies.Above undergraduate, preferably in PhD in relevant subjects.Education background in Physics, Chemistry, Material Science, Chemical Engineering, Electronic Engineering etcCandidates MUST be eligible to, and hold all relevant finalised paperwork, to live and work in the UK. Copies of passport and Visas will be requestedProject People is acting as an Employment Agency in relation to this vacancy.